Center for Relativistic Laser Science

1. Equipment name : 웨지본더 (Wedge bonder)

2. Manufacture and Model

- Kulicke & Soffa Industries Inc, 2013

- model-4526

3. Purpose

- Wire-bonding is a method to make an electrical connection between a silicon die and a package lead in a microelectronic device.

4. Specification and performance :

- Full manual mode

- Niobium (annealed) Aluminum and gold wire available

- 90 degree clamp and spool for deep access

- Heater stage and temperature controller

5. Location and Picture :

  IBS Headquarter C187 Microscope lab