Center for Relativistic Laser Science

1. Process Chamber & Top Plate Assembly
- Material : SUS304
- Pumping Port : DN250mm
- Viewport Window
- Viewport Shutter(Manual)
- Sensor Port : DN16
- Spare Port : DN25, DN40
- Gas Inlet Port
- Chamber Lid(Door)
- Sputter Gun Port : 2

- Gun Shutter
- Number of sputter guns : 4
- 2 guns for chalcogenide targets
- 1 gun for metal
- 1 gun for capping insulator

2. Bottom Plate Assembly
- Substrate Rotation : 25W, Break Motor
- Magnetic Fluid Seal, Speed : 60RPM
- Gate Valve : ISO250mm, Pneumatic Control
- Process Pressure Gauge : 0.1Torr
- Up/Down : 25W, Reversible Motor
- Bellows Seal, Heater : SiC(Max. 600℃)
- Thermocouple Sensor : K Type

3. Pumping System
- Cryo Pump(>1000liter)
- Roughing Valve : KF40, Pneumatic Control
- Foreline Valve : KF25, Pneumatic Control
- Heating System for N2 supply
- Gate Valve : ISO250mm, Pneumatic Control
- Process Pressure Gauge : 0.1Torr
- Throttle Valve for pressure control: ISO 250mm

4. Gas Delivery System
- MFC : Ar, N2, O2(100sccm)
- VCR Fitting

5. Manual Loadlock
- Slit Valve for isolation with process chamber
- Wafer transfer bar
- Loadlock door with viewport : Manual
- Pressure Gauge : Convection
- ATM Sensor
- Position sensor : Limit Switch
- Vacuum Valve : KF25 angle Valve

6. Power Box & Control System
- Main Power : 220VAC, 3 Phase, 100A
- Safety Interlock : Air, Water, CDA, N2
- IO Module : EtherCAT(Germany)
- Computer : Intel Core2 DUO, 2GB DDR RAM

7. Operation Software
- Graphic User Interface
- Co-Sputtering operation software
- Easy maintenance view
- Access level setting (ID, Password)

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