IBS Institute for Basic Science
Search
Home Print Page

Pattern generator

equipment explanation
Model Heidelberg Pattern Generator (upg-101)
Operating time SUN(00:00~24:00)
MON(00:00~24:00)
TUE(00:00~24:00)
WED(00:00~24:00)
THU(00:00~24:00)
FRI(00:00~24:00)
SAT(00:00~24:00)
Location 86698(yellow room)
inquiry Hosub Lim
010-9466-1672
lim.hosub.skku@gmail.com
Reservation

Notice

Notice * This equipment is in clean room * Available Time // Always possible. Notice // If you want to have training for using this equipment please contact Super-user. Current Status // Now on operation.

- This equipment is direct lithography tool with laser system. Standard substrate types are as follow:

1. Soda-lime or quartz plate with chromium coating with anti-reflection layer (e.g., chromium-oxide)

2. Silicon wafers (recommendation)

- General details for substrate choice

1. Size : 2 to 5 inch (recommendation to use 4 inch wafer)

2. Maximum thickness : 6 mm

3. Flatness/parallelism: < ±20 m

 

< Specification of Pattern generator >

Diode laser wavelength : 405 nm diode laser for positive photoresist (GXR 601, AZ series etc.), also possible to use negative photoresist (SU-8 series, 375 nm with UV option)

Minimum structure size (width) : 1 [m]

Structure height range : 0.5 – 10 [m] (Check with Super-user)

Writhe Speed : 5 X 5 [〖mm〗^2/min]

Edge Roughness : 120 [3σ,nm]

Line width uniformity : 200 [3σ,nm]

Alignment Measurement Accuracy : 200 [3σ,nm]

LIST